Use of photoresist in substrate vias during backside grind

A structure and method of formation. The substrate has front and back surfaces on opposite sides of the substrate. The substrate has a backside portion extending from the back surface to a second depth into the substrate as measured from the front surface. At least one via is formed in the substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KRYWANCZYK TIMOTHY C, BROUILLETTE DONALD W, DANAHER JOSEPH D, WELLS AMYE L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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