Mold die and method for manufacturing semiconductor device using the same

An object of the present invention is to provide a technology that can seal the opening of the interposer by transfer mold with the leak of the insulating resin from the above-described opening prevented. A mold die comprising a first die having a recess in a predetermined form and a second flat die...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKAMOTO AKIHIRO, SHIMAZAKI YOSUKE, KOMIYA KAZUMOTO, SHIBATA AKIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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