High concentration silica slurry
A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa.s, wherein the silic...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MORII TOSHIO BRANDL PAUL |
| description | A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa.s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 mum to 0.8 mum. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2004129176A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2004129176A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2004129176A13</originalsourceid><addsrcrecordid>eNrjZFDwyEzPUEjOz0tOzSspSizJzM9TKM7MyUxOVCjOKS0qquRhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYlAjakl8aHBRgYGJoZGlobmZo6GxsSpAgADDiZ4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High concentration silica slurry</title><source>esp@cenet</source><creator>MORII TOSHIO ; BRANDL PAUL</creator><creatorcontrib>MORII TOSHIO ; BRANDL PAUL</creatorcontrib><description>A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa.s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 mum to 0.8 mum.</description><edition>7</edition><language>eng</language><subject>ADHESIVES ; CHEMISTRY ; COMPOUNDS THEREOF ; DYES ; INORGANIC CHEMISTRY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-METALLIC ELEMENTS ; PAINTS ; POLISHES ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; PREPARATION OF CARBON BLACK ; SKI WAXES ; TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040708&DB=EPODOC&CC=US&NR=2004129176A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040708&DB=EPODOC&CC=US&NR=2004129176A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORII TOSHIO</creatorcontrib><creatorcontrib>BRANDL PAUL</creatorcontrib><title>High concentration silica slurry</title><description>A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa.s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 mum to 0.8 mum.</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOUNDS THEREOF</subject><subject>DYES</subject><subject>INORGANIC CHEMISTRY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-METALLIC ELEMENTS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>PREPARATION OF CARBON BLACK</subject><subject>SKI WAXES</subject><subject>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwyEzPUEjOz0tOzSspSizJzM9TKM7MyUxOVCjOKS0qquRhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYlAjakl8aHBRgYGJoZGlobmZo6GxsSpAgADDiZ4</recordid><startdate>20040708</startdate><enddate>20040708</enddate><creator>MORII TOSHIO</creator><creator>BRANDL PAUL</creator><scope>EVB</scope></search><sort><creationdate>20040708</creationdate><title>High concentration silica slurry</title><author>MORII TOSHIO ; BRANDL PAUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2004129176A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOUNDS THEREOF</topic><topic>DYES</topic><topic>INORGANIC CHEMISTRY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-METALLIC ELEMENTS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>PREPARATION OF CARBON BLACK</topic><topic>SKI WAXES</topic><topic>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>MORII TOSHIO</creatorcontrib><creatorcontrib>BRANDL PAUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORII TOSHIO</au><au>BRANDL PAUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High concentration silica slurry</title><date>2004-07-08</date><risdate>2004</risdate><abstract>A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa.s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 mum to 0.8 mum.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2004129176A1 |
| source | esp@cenet |
| subjects | ADHESIVES CHEMISTRY COMPOUNDS THEREOF DYES INORGANIC CHEMISTRY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-METALLIC ELEMENTS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PREPARATION OF CARBON BLACK SKI WAXES TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES |
| title | High concentration silica slurry |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T15%3A11%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORII%20TOSHIO&rft.date=2004-07-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2004129176A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |