Semiconductor device and method for fabricating the same

A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAI YOSHIYUKI, YAGUCHI YASUTAKE, YUI TAKASHI, ITOU FUMITO, TAKEOKA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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