Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates

During a selective oxidation of gate structures that includes a polycrystalline silicon layer and a tungsten layer, which is known per se, a vapor deposition of tungsten oxide is prevented or at least greatly reduced by a special process. The gate structure is acted on by a hydrogen-containing, nona...

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Hauptverfasser: SCHOER ERWIN, KEGEL WILHELM, ROTERS GEORG, FRIGGE STEFFEN, SACHSE JENS-UWE, HAYN REGINA, STORBECK OLAF, STADTMULLER MICHAEL
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creator SCHOER ERWIN
KEGEL WILHELM
ROTERS GEORG
FRIGGE STEFFEN
SACHSE JENS-UWE
HAYN REGINA
STORBECK OLAF
STADTMULLER MICHAEL
description During a selective oxidation of gate structures that includes a polycrystalline silicon layer and a tungsten layer, which is known per se, a vapor deposition of tungsten oxide is prevented or at least greatly reduced by a special process. The gate structure is acted on by a hydrogen-containing, nonaqueous inert gas before and, if appropriate, after a treatment step with a hydrogen/water mixture.
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates
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