Methods and apparatuses for analyzing solder plating solutions

The present invention relates to methods and apparatus for determining concentrations of various inorganic or organic components in solder plating solutions, which include titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HILGARTH MONICA K, SCHOMBURG CORY, TOLMACHEV YURIY, ROBERTSON PETER M, KING MACKENZIE E, SCHOENROGGE UWE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to methods and apparatus for determining concentrations of various inorganic or organic components in solder plating solutions, which include titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis.