Method and apparatus for etch rate uniformity control

A method for controlling a process on a substrate. The method comprising: providing the substrate, the substrate having an upper surface, an opposite lower surface and an edge between the upper and lower surfaces; processing the upper surface of the substrate with a first fluid; directing a second f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SNYDER JOHN J, GRANT CASEY J, SHARROW JOEL M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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