Controlled impedance for wire bonding interconnects

A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection be...

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Bibliographische Detailangaben

Hauptverfasser:	RANGANATHAN RAMASWAMY, THURAIRAJARATNAM ARITHARAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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