Projection print engine and method for forming same

Semiconductor print engine structures (304) are formed by growing high quality epitaxial layers (26) of monocrystalline materials overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. The compliant substrate in...

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Bibliographische Detailangaben
Hauptverfasser: HOLM PAIGE M, RICHARD FRED V
Format: Patent
Sprache:eng
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Zusammenfassung:Semiconductor print engine structures (304) are formed by growing high quality epitaxial layers (26) of monocrystalline materials overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. The compliant substrate includes an accommodating buffer layer (24) including a layer of monocrystalline oxide spaced apart from a silicon wafer (22) by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer (28) dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer (24).