Method and apparatus for underfilling semiconductor devices

A method and apparatus for underfilling a gap between a multi-sided die and a substrate with an encapsulant material. The die and/or the substrate is heated non-uniformly by a heat source to generate a temperature gradient therein. The heated one of the die and the substrate transfers heat energy in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FANG LIANG, RATLEDGE THOMAS LAFERL, QUINONES HORATIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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