Semiconductor device
A semiconductor device of the present invention includes the multi-stacked structure having the bottom semiconductor package with BGA or PGA terminals so that the total number of terminals of the semiconductor device can be increased without increasing the mounting area. In particular, the semicondu...
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| creator | FUKUDA TATSUYA OTANI TOMOKAZU |
| description | A semiconductor device of the present invention includes the multi-stacked structure having the bottom semiconductor package with BGA or PGA terminals so that the total number of terminals of the semiconductor device can be increased without increasing the mounting area. In particular, the semiconductor device includes a first semiconductor package having an upper and lower surfaces. The first semiconductor package has a plurality of land terminals on the lower surface. The semiconductor device also includes a second semiconductor package having a planer configuration substantially the same as that of the first semiconductor package, which is provided on the upper surface of the first semiconductor package. The second semiconductor package has a plurality of lead terminals extending from a side surface of the second semiconductor package. |
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In particular, the semiconductor device includes a first semiconductor package having an upper and lower surfaces. The first semiconductor package has a plurality of land terminals on the lower surface. The semiconductor device also includes a second semiconductor package having a planer configuration substantially the same as that of the first semiconductor package, which is provided on the upper surface of the first semiconductor package. The second semiconductor package has a plurality of lead terminals extending from a side surface of the second semiconductor package.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030710&DB=EPODOC&CC=US&NR=2003127721A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030710&DB=EPODOC&CC=US&NR=2003127721A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUDA TATSUYA</creatorcontrib><creatorcontrib>OTANI TOMOKAZU</creatorcontrib><title>Semiconductor device</title><description>A semiconductor device of the present invention includes the multi-stacked structure having the bottom semiconductor package with BGA or PGA terminals so that the total number of terminals of the semiconductor device can be increased without increasing the mounting area. In particular, the semiconductor device includes a first semiconductor package having an upper and lower surfaces. The first semiconductor package has a plurality of land terminals on the lower surface. The semiconductor device also includes a second semiconductor package having a planer configuration substantially the same as that of the first semiconductor package, which is provided on the upper surface of the first semiconductor package. 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In particular, the semiconductor device includes a first semiconductor package having an upper and lower surfaces. The first semiconductor package has a plurality of land terminals on the lower surface. The semiconductor device also includes a second semiconductor package having a planer configuration substantially the same as that of the first semiconductor package, which is provided on the upper surface of the first semiconductor package. The second semiconductor package has a plurality of lead terminals extending from a side surface of the second semiconductor package.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Semiconductor device |
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