Fluxing compositions
The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable...
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| creator | KINNEY ROBERT J CHARLES SCOTT B KROPP MICHAEL A |
| description | The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions. |
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The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COMPOSITIONS BASED THEREON ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030619&DB=EPODOC&CC=US&NR=2003111519A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030619&DB=EPODOC&CC=US&NR=2003111519A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KINNEY ROBERT J</creatorcontrib><creatorcontrib>CHARLES SCOTT B</creatorcontrib><creatorcontrib>KROPP MICHAEL A</creatorcontrib><title>Fluxing compositions</title><description>The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxyymtyMxLV0jOzy3IL84syczPK-ZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBsaGhoamhpaOhsbEqQIA83ciAQ</recordid><startdate>20030619</startdate><enddate>20030619</enddate><creator>KINNEY ROBERT J</creator><creator>CHARLES SCOTT B</creator><creator>KROPP MICHAEL A</creator><scope>EVB</scope></search><sort><creationdate>20030619</creationdate><title>Fluxing compositions</title><author>KINNEY ROBERT J ; CHARLES SCOTT B ; KROPP MICHAEL A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2003111519A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KINNEY ROBERT J</creatorcontrib><creatorcontrib>CHARLES SCOTT B</creatorcontrib><creatorcontrib>KROPP MICHAEL A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KINNEY ROBERT J</au><au>CHARLES SCOTT B</au><au>KROPP MICHAEL A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fluxing compositions</title><date>2003-06-19</date><risdate>2003</risdate><abstract>The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WELDING WORKING BY LASER BEAM |
| title | Fluxing compositions |
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