Buckle of IC heat dissipating device

A buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket comprises a pair of clamping arms; a supporting frame being fixed to a top of the heat dissipating fin device; and an operation rod having a camshaft and a lever f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOU, CHUANG TSAN-WEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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