Buckle of IC heat dissipating device

A buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket comprises a pair of clamping arms; a supporting frame being fixed to a top of the heat dissipating fin device; and an operation rod having a camshaft and a lever for rotating the camshaft. The camshaft passes through the supporting frame and is capable of rotating freely. In operation position, the cam of the camshaft will eject the pivotal connection of the clamping arms and the clamping arms will bend and deform. By the restoring force of these clamping arms, the ears at two ends of the clamping arms have sufficient forces to hook the hooks at two sides of the IC socket. In installing the present invention, the user only needs to press an operation portion slightly.