SUBSTRATE SUPPORT WITH MULTILEVEL HEAT TRANSFER MECHANISM

A substrate support having heat transfer enhancing topography. Generally, the substrate support includes a first side that supports the substrate and a second side. A ring and a plurality of substrate support pads project from the first side. The ring is disposed proximate the perimeter of the subst...

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Bibliographische Detailangaben
Hauptverfasser: TZOU CHIEN-SHIUNG, TSAI CHENG-HSIUNG
Format: Patent
Sprache:eng
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