Method and apparatus for non-destructive testing of leaded packages

Method and apparatus for non-destructive testing of leaded packages

A method of non-destructively testing the adhesion of electrical leads joined to a package comprising the steps of holding the package and a portion of a lead in respective stationary positions, applying a force to the lead proximate an area where it's joined to the package, and measuring the r...

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Hauptverfasser: SZWEC RICHARD JAMES, DONOHO EDWARD HUNT
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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creator SZWEC RICHARD JAMES
DONOHO EDWARD HUNT
description A method of non-destructively testing the adhesion of electrical leads joined to a package comprising the steps of holding the package and a portion of a lead in respective stationary positions, applying a force to the lead proximate an area where it's joined to the package, and measuring the resistance of the lead to the force. An apparatus for holding the package and leads during such testing comprising first and second holding members, each having three arms connected by a transverse member.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title Method and apparatus for non-destructive testing of leaded packages
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