Insulated bond wire assembly process technology for integrated circuits

Insulated bond wire assembly process technology for integrated circuits

An insulated bond wire to connect integrated circuits to each other or to substrates. Insulated bond wires may allow bond wires connecting integrated circuits and substrates to cross without shorting. Because bond wires may be crossed, integrated circuit assemblies with crossing bond wires may not n...

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1. Verfasser: PON HARRY Q
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description An insulated bond wire to connect integrated circuits to each other or to substrates. Insulated bond wires may allow bond wires connecting integrated circuits and substrates to cross without shorting. Because bond wires may be crossed, integrated circuit assemblies with crossing bond wires may not need to be redesigned to avoid the wire crossings. In addition, insulated bond wires may also allow for closer spacing between bond wires due to reduced electronic interference between the wires. Closer spacing may allow for more input and output ports on an integrated circuit and thus increase its functionality.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Insulated bond wire assembly process technology for integrated circuits
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