Stress-free lead frame

The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression whil...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SIN LEE HUAN, KENG LIOW ENG, KONG THUM MIN, HUAT LEE KOCK, MENG CHAN BOON, HING CHEN CHOON, TUCK CHEONG MUN, KEUNG PHUAH KIAN, ETURAJULU ARAVENTHAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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