Flame-retardant pressure-sensitive adhesive composition and flame-retardant pressure-sensitive adhesive tape
A flame-retardant pressure-sensitive adhesive composition having both excellent tackiness and flame retardancy is described which comprises, as flame-retardants, (A) ethylenebispentabromobiphenyl, and (B) a brominated bisphenol and (C) antimony trioxide and, as a base polymer, (D) an acrylic polymer...
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| creator | HANAI HIROOMI |
| description | A flame-retardant pressure-sensitive adhesive composition having both excellent tackiness and flame retardancy is described which comprises, as flame-retardants, (A) ethylenebispentabromobiphenyl, and (B) a brominated bisphenol and (C) antimony trioxide and, as a base polymer, (D) an acrylic polymer, said flame-retardant components (A), (B) and (C), in terms of weight ratio, satisfying the following equations: 2 |
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and a flame-retardant pressure-sensitive adhesive tape using the composition and electronic parts or a transformer utilizing the tape are also described.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020801&DB=EPODOC&CC=US&NR=2002102401A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020801&DB=EPODOC&CC=US&NR=2002102401A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANAI HIROOMI</creatorcontrib><title>Flame-retardant pressure-sensitive adhesive composition and flame-retardant pressure-sensitive adhesive tape</title><description>A flame-retardant pressure-sensitive adhesive composition having both excellent tackiness and flame retardancy is described which comprises, as flame-retardants, (A) ethylenebispentabromobiphenyl, and (B) a brominated bisphenol and (C) antimony trioxide and, as a base polymer, (D) an acrylic polymer, said flame-retardant components (A), (B) and (C), in terms of weight ratio, satisfying the following equations: 2<=[(A)+(B)]/(C)<=6 and (B)<=(A), and said [(A)+(B)] being added in an amount of from 30 to 90 parts by weight and said (B) being added in an amount of 15 parts by weight or greater, each based on 100 parts by weight of the base polymer (D); and a flame-retardant pressure-sensitive adhesive tape using the composition and electronic parts or a transformer utilizing the tape are also described.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqVi0EKwjAQRbNxIeodAq4DSfQCIhb36roMzS8W0mTIjJ5fCh5AV__xeH9tcpdphmtQaomKWm4QeTU4QZFJpzcspSdkgaHOXBdZi6WS7PjHV4mxNauRsmD33Y3Zd5f7-erAtYcwDSjQ_nGL3sfg49GHUzj8Vn0AAVJEEA</recordid><startdate>20020801</startdate><enddate>20020801</enddate><creator>HANAI HIROOMI</creator><scope>EVB</scope></search><sort><creationdate>20020801</creationdate><title>Flame-retardant pressure-sensitive adhesive composition and flame-retardant pressure-sensitive adhesive tape</title><author>HANAI HIROOMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2002102401A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>HANAI HIROOMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANAI HIROOMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flame-retardant pressure-sensitive adhesive composition and flame-retardant pressure-sensitive adhesive tape</title><date>2002-08-01</date><risdate>2002</risdate><abstract>A flame-retardant pressure-sensitive adhesive composition having both excellent tackiness and flame retardancy is described which comprises, as flame-retardants, (A) ethylenebispentabromobiphenyl, and (B) a brominated bisphenol and (C) antimony trioxide and, as a base polymer, (D) an acrylic polymer, said flame-retardant components (A), (B) and (C), in terms of weight ratio, satisfying the following equations: 2<=[(A)+(B)]/(C)<=6 and (B)<=(A), and said [(A)+(B)] being added in an amount of from 30 to 90 parts by weight and said (B) being added in an amount of 15 parts by weight or greater, each based on 100 parts by weight of the base polymer (D); and a flame-retardant pressure-sensitive adhesive tape using the composition and electronic parts or a transformer utilizing the tape are also described.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS DYES ELECTRICITY INSULATORS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | Flame-retardant pressure-sensitive adhesive composition and flame-retardant pressure-sensitive adhesive tape |
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