Flip chip package with improved cap design and process for making thereof

Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FARQUHAR DONALD S, HOUSER DAVID E, PAPATHOMAS KONSTANTINOS I
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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