Modular high power solid state amplifier
A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; ther...
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creator | PEITZ JOHN MARTIN COOK DEAN L STANFIELD EDWIN JACK LYONS MICHAEL R |
description | A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device. |
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The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.</description><edition>7</edition><language>eng</language><subject>AMPLIFIERS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRICITY</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020704&DB=EPODOC&CC=US&NR=2002084852A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020704&DB=EPODOC&CC=US&NR=2002084852A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PEITZ JOHN MARTIN</creatorcontrib><creatorcontrib>COOK DEAN L</creatorcontrib><creatorcontrib>STANFIELD EDWIN JACK</creatorcontrib><creatorcontrib>LYONS MICHAEL R</creatorcontrib><title>Modular high power solid state amplifier</title><description>A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.</description><subject>AMPLIFIERS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwzU8pzUksUsjITM9QKMgvTy1SKM7PyUxRKC5JLElVSMwtyMlMy0wt4mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgYGRgYWJhamRo6GxsSpAgBt0yk3</recordid><startdate>20020704</startdate><enddate>20020704</enddate><creator>PEITZ JOHN MARTIN</creator><creator>COOK DEAN L</creator><creator>STANFIELD EDWIN JACK</creator><creator>LYONS MICHAEL R</creator><scope>EVB</scope></search><sort><creationdate>20020704</creationdate><title>Modular high power solid state amplifier</title><author>PEITZ JOHN MARTIN ; COOK DEAN L ; STANFIELD EDWIN JACK ; LYONS MICHAEL R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2002084852A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>AMPLIFIERS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>PEITZ JOHN MARTIN</creatorcontrib><creatorcontrib>COOK DEAN L</creatorcontrib><creatorcontrib>STANFIELD EDWIN JACK</creatorcontrib><creatorcontrib>LYONS MICHAEL R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PEITZ JOHN MARTIN</au><au>COOK DEAN L</au><au>STANFIELD EDWIN JACK</au><au>LYONS MICHAEL R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Modular high power solid state amplifier</title><date>2002-07-04</date><risdate>2002</risdate><abstract>A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | AMPLIFIERS BASIC ELECTRONIC CIRCUITRY ELECTRICITY |
title | Modular high power solid state amplifier |
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