Transferring apparatus for chips and method of use
A measuring and classifying apparatus (transferring apparatus) for chips includes an immovable base and a turn table (transferring member). The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovabl...
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creator | INOUE TETSUICHI KURABE MIKI SAWA SATOSHI |
description | A measuring and classifying apparatus (transferring apparatus) for chips includes an immovable base and a turn table (transferring member). The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovable base and suction passes for chucking the chips. The chips are transferred above the immovable base while being chucked in the receiving concavities. The suction passes are formed at the upper corner portions of the receiving concavities, so that the chips are chucked in such a manner that gaps are provided between the chips and the upper surface of the immovable base. |
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The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovable base and suction passes for chucking the chips. The chips are transferred above the immovable base while being chucked in the receiving concavities. The suction passes are formed at the upper corner portions of the receiving concavities, so that the chips are chucked in such a manner that gaps are provided between the chips and the upper surface of the immovable base.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PACKING ; PERFORMING OPERATIONS ; PHYSICS ; PNEUMATIC TUBE CONVEYORS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TESTING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020502&DB=EPODOC&CC=US&NR=2002050443A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020502&DB=EPODOC&CC=US&NR=2002050443A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOUE TETSUICHI</creatorcontrib><creatorcontrib>KURABE MIKI</creatorcontrib><creatorcontrib>SAWA SATOSHI</creatorcontrib><title>Transferring apparatus for chips and method of use</title><description>A measuring and classifying apparatus (transferring apparatus) for chips includes an immovable base and a turn table (transferring member). The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovable base and suction passes for chucking the chips. The chips are transferred above the immovable base while being chucked in the receiving concavities. The suction passes are formed at the upper corner portions of the receiving concavities, so that the chips are chucked in such a manner that gaps are provided between the chips and the upper surface of the immovable base.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONVEYING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PNEUMATIC TUBE CONVEYORS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHOP CONVEYOR SYSTEMS</subject><subject>STORING</subject><subject>TESTING</subject><subject>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKKUrMK05LLSrKzEtXSCwoSCxKLCktVkjLL1JIzsgsKFZIzEtRyE0tychPUchPUygtTuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBkYGpgYmJsaOhsbEqQIAedEszw</recordid><startdate>20020502</startdate><enddate>20020502</enddate><creator>INOUE TETSUICHI</creator><creator>KURABE MIKI</creator><creator>SAWA SATOSHI</creator><scope>EVB</scope></search><sort><creationdate>20020502</creationdate><title>Transferring apparatus for chips and method of use</title><author>INOUE TETSUICHI ; KURABE MIKI ; SAWA SATOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2002050443A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONVEYING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PNEUMATIC TUBE CONVEYORS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHOP CONVEYOR SYSTEMS</topic><topic>STORING</topic><topic>TESTING</topic><topic>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>INOUE TETSUICHI</creatorcontrib><creatorcontrib>KURABE MIKI</creatorcontrib><creatorcontrib>SAWA SATOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INOUE TETSUICHI</au><au>KURABE MIKI</au><au>SAWA SATOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Transferring apparatus for chips and method of use</title><date>2002-05-02</date><risdate>2002</risdate><abstract>A measuring and classifying apparatus (transferring apparatus) for chips includes an immovable base and a turn table (transferring member). The turn table is rotatably disposed on an upper surface of the immovable base, and is provided with receiving concavities for receiving chips with the immovable base and suction passes for chucking the chips. The chips are transferred above the immovable base while being chucked in the receiving concavities. The suction passes are formed at the upper corner portions of the receiving concavities, so that the chips are chucked in such a manner that gaps are provided between the chips and the upper surface of the immovable base.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TESTING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
title | Transferring apparatus for chips and method of use |
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