Semiconductor device and method for forming contact holes in a semiconductor device

A protective film (14) on a conductor (11d), where a contact hole (22) is to be formed, is removed in advance in a forming process of an etched-away opening (20) to expose the top portion of the corresponding conductor (11d) from the top surface of an insulating film (15), which has buried therein t...

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Bibliographische Detailangaben

1. Verfasser:	FUJIMOTO MAMORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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