METHOD FOR FORMING A COPPER FILM ON A SUBSTRATE

Adhesion of a copper film, such as a copper interconnect, to a substrate underlayer, such as a substrate diffusion barrier, is enhanced with adhesion promotion techniques. The adhesion promotion techniques can repair the interface of the copper film and the substrate to enhance adhesion of the coppe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHANG GUIHUA, VELO LINO A, OMSTEAD THOMAS R, LIU ZEMING, PARANJPE AJIT P, CAMPBELL DAVID R, MOSLEHI MEHRDAD M
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!