Semiconductor apparatus and manufacturing method therefor

In a semiconductor apparatus comprising a semiconductor chip, a wiring substrate having the semiconductor chip mounted thereon, an under-fill resin sheet interposed between the semiconductor chip and the wiring substrate, and a resin sealing body for sealing the semiconductor chip, the under-fill re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUNAKURA HIROSHI, HOSOMI EIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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