Electrical coupling between chamber parts in electronic device processing equipment

An electrical coupling is provided between chamber parts of electronic device processing equipment (e.g., equipment used for processing semiconductor wafers) to reduce differences in the electrical potential between such parts. The coupling prevents or at least reduces the presence of plasma or exci...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GOLOVATO STEPHEN N, KENT MARTIN A, TOURE ABRON
Format: Patent
Sprache:eng
Schlagworte:
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