METHOD OF MANUFACTURING METALLIC INTERCONNECTS

A method of manufacturing metallic interconnects. A substrate has a copper line formed therein. An inter-metal dielectric layer is formed over the substrate and the copper line. A patterned photoresist layer is formed over the inter-metal dielectric layer. The inter-metal dielectric layer is etched...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUANG HSI-TA, YANG CHAN-LON, CHEN TONG-YU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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