Method of producing a pressure sensor component

The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface. The method comprises the steps of mounting and contacting a se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	STADLER BERND, NEU ACHIM, BOOTZ ERIC, WINTERER JURGEN, JANCZEK THIES
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING
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