Semiconductor package

A semiconductor package includes: a first semiconductor chip; a second semiconductor chip stacked on the first semiconductor chip; an underfill material layer interposed between the first semiconductor chip and the second semiconductor chip; and a first dam structure disposed on the first semiconduc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Teakhoon, Park, Sechul, Kang, Unbyoung, Choi, Juil, Park, Sangsick, Yun, Hyojin, Lee, Hyoungjoo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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