Electrolytic copper foil

Provided is an electrodeposited copper foil having high smoothness and exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has an Rz of 0.1 to 2.0 μm on at least one surface. In cross-...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nakajima, Daisuke, Hara, Yasuji, Wada, Mitsuhiro, Matsuda, Mitsuyoshi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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