Component carrier with surface-contactable component embedded in laminated stack
A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at lea...
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| creator | Moitzi, Heinz Stahr, Johannes Zluc, Andreas |
| description | A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack. |
| format | Patent |
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241210&DB=EPODOC&CC=US&NR=12165940B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241210&DB=EPODOC&CC=US&NR=12165940B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Moitzi, Heinz</creatorcontrib><creatorcontrib>Stahr, Johannes</creatorcontrib><creatorcontrib>Zluc, Andreas</creatorcontrib><title>Component carrier with surface-contactable component embedded in laminated stack</title><description>A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhwzs8tyM9LzStRSE4sKspMLVIozyzJUCguLUpLTE7VTc7PK0lMLklMyklVSIYrTc1NSk1JSU1RyMxTyEnMzcxLLAFyioEqs3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxAdDQvNSS-NBgQyNDM1NLEwMnI2Ni1AAA3wE36Q</recordid><startdate>20241210</startdate><enddate>20241210</enddate><creator>Moitzi, Heinz</creator><creator>Stahr, Johannes</creator><creator>Zluc, Andreas</creator><scope>EVB</scope></search><sort><creationdate>20241210</creationdate><title>Component carrier with surface-contactable component embedded in laminated stack</title><author>Moitzi, Heinz ; Stahr, Johannes ; Zluc, Andreas</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12165940B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Moitzi, Heinz</creatorcontrib><creatorcontrib>Stahr, Johannes</creatorcontrib><creatorcontrib>Zluc, Andreas</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Moitzi, Heinz</au><au>Stahr, Johannes</au><au>Zluc, Andreas</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Component carrier with surface-contactable component embedded in laminated stack</title><date>2024-12-10</date><risdate>2024</risdate><abstract>A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Component carrier with surface-contactable component embedded in laminated stack |
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