Switching power supply including wiring layer
A switching power supply is mounted on a printed circuit board. A first wiring layer of the printed circuit board includes a DC line through which a DC voltage is supplied, and a first ground region and a second ground region formed at a distance from the DC line and with the DC line interposed betw...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Mimino, Yutaka |
description | A switching power supply is mounted on a printed circuit board. A first wiring layer of the printed circuit board includes a DC line through which a DC voltage is supplied, and a first ground region and a second ground region formed at a distance from the DC line and with the DC line interposed between them. A lower-layer ground region is formed in a second wiring layer. An insulating layer includes multiple first through holes provided along one side of the first ground region so as to electrically connect the first ground region and the lower-layer ground region, and multiple second through holes provided along one side of the second ground region so as to electrically connect the second ground region and the lower-layer ground region. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12149171B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12149171B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12149171B23</originalsourceid><addsrcrecordid>eNrjZNANLs8sSc7IzEtXKMgvTy1SKC4tKMipVMjMS84pTQEJl2cWgaicxMrUIh4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEh8abGhkaGJpaG7oZGRMjBoABa8q0A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Switching power supply including wiring layer</title><source>esp@cenet</source><creator>Mimino, Yutaka</creator><creatorcontrib>Mimino, Yutaka</creatorcontrib><description>A switching power supply is mounted on a printed circuit board. A first wiring layer of the printed circuit board includes a DC line through which a DC voltage is supplied, and a first ground region and a second ground region formed at a distance from the DC line and with the DC line interposed between them. A lower-layer ground region is formed in a second wiring layer. An insulating layer includes multiple first through holes provided along one side of the first ground region so as to electrically connect the first ground region and the lower-layer ground region, and multiple second through holes provided along one side of the second ground region so as to electrically connect the second ground region and the lower-layer ground region.</description><language>eng</language><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONTROL OR REGULATION THEREOF ; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241119&DB=EPODOC&CC=US&NR=12149171B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241119&DB=EPODOC&CC=US&NR=12149171B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Mimino, Yutaka</creatorcontrib><title>Switching power supply including wiring layer</title><description>A switching power supply is mounted on a printed circuit board. A first wiring layer of the printed circuit board includes a DC line through which a DC voltage is supplied, and a first ground region and a second ground region formed at a distance from the DC line and with the DC line interposed between them. A lower-layer ground region is formed in a second wiring layer. An insulating layer includes multiple first through holes provided along one side of the first ground region so as to electrically connect the first ground region and the lower-layer ground region, and multiple second through holes provided along one side of the second ground region so as to electrically connect the second ground region and the lower-layer ground region.</description><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONTROL OR REGULATION THEREOF</subject><subject>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANLs8sSc7IzEtXKMgvTy1SKC4tKMipVMjMS84pTQEJl2cWgaicxMrUIh4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEh8abGhkaGJpaG7oZGRMjBoABa8q0A</recordid><startdate>20241119</startdate><enddate>20241119</enddate><creator>Mimino, Yutaka</creator><scope>EVB</scope></search><sort><creationdate>20241119</creationdate><title>Switching power supply including wiring layer</title><author>Mimino, Yutaka</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12149171B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONTROL OR REGULATION THEREOF</topic><topic>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Mimino, Yutaka</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mimino, Yutaka</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Switching power supply including wiring layer</title><date>2024-11-19</date><risdate>2024</risdate><abstract>A switching power supply is mounted on a printed circuit board. A first wiring layer of the printed circuit board includes a DC line through which a DC voltage is supplied, and a first ground region and a second ground region formed at a distance from the DC line and with the DC line interposed between them. A lower-layer ground region is formed in a second wiring layer. An insulating layer includes multiple first through holes provided along one side of the first ground region so as to electrically connect the first ground region and the lower-layer ground region, and multiple second through holes provided along one side of the second ground region so as to electrically connect the second ground region and the lower-layer ground region.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US12149171B2 |
source | esp@cenet |
subjects | APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Switching power supply including wiring layer |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T12%3A31%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Mimino,%20Yutaka&rft.date=2024-11-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12149171B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |