Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same

A semiconductor package structure includes a package substrate; a semiconductor chip on the package substrate and electrically connected to the package substrate; an interposer substrate above the package substrate and the semiconductor chip, wherein the interposer substrate includes a cavity recess...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shim, Jongbo, Yim, Choongbin, Kim, Jihwang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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