Processing apparatus and workpiece processing method

Processing apparatus and workpiece processing method

A workpiece processing method for processing a workpiece using a processing apparatus including a chuck table, a processing unit, a moving mechanism for moving the chuck table and the processing unit relative to each other, and an imaging unit for imaging the workpiece, where the chuck table include...

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Hauptverfasser: Odanaka, Kentaro, Masuda, Yukiyasu
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Odanaka, Kentaro
Masuda, Yukiyasu
description A workpiece processing method for processing a workpiece using a processing apparatus including a chuck table, a processing unit, a moving mechanism for moving the chuck table and the processing unit relative to each other, and an imaging unit for imaging the workpiece, where the chuck table includes a holding member formed by a transparent body and a supporting member supporting a part of the holding member and connected to an angle control mechanism. The method includes a tape affixing step, a holding step of holding the workpiece by the chuck table via the tape, and an identifying step of imaging the top surface side of the workpiece through the transparent holding member by the imaging unit positioned in a region that is on a lower side of the holding member and is not superimposed on the supporting member, and identifying a region to be processed in the workpiece.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Processing apparatus and workpiece processing method
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