Interface assembly and method for manufacturing interface assembly
An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molde...
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| creator | Korhonen, Pasi Wuori, Topi Apilo, Pälvi Hänninen, Ilpo Bräysy, Vinski Keränen, Antti Simula, Tomi Heikkinen, Mikko Sääski, Jarmo |
| description | An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12137523B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12137523B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12137523B13</originalsourceid><addsrcrecordid>eNrjZHDyzCtJLUpLTE5VSCwuTs1NyqlUSMxLUchNLcnIT1FIyy9SyE3MKwUqKCktysxLV8jEUM_DwJqWmFOcyguluRkU3VxDnD10Uwvy41OLC4Bq81JL4kODDY0Mjc1NjYydDI2JUQMAcPcynA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Interface assembly and method for manufacturing interface assembly</title><source>esp@cenet</source><creator>Korhonen, Pasi ; Wuori, Topi ; Apilo, Pälvi ; Hänninen, Ilpo ; Bräysy, Vinski ; Keränen, Antti ; Simula, Tomi ; Heikkinen, Mikko ; Sääski, Jarmo</creator><creatorcontrib>Korhonen, Pasi ; Wuori, Topi ; Apilo, Pälvi ; Hänninen, Ilpo ; Bräysy, Vinski ; Keränen, Antti ; Simula, Tomi ; Heikkinen, Mikko ; Sääski, Jarmo</creatorcontrib><description>An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK ; PERFORMING OPERATIONS ; PHYSICS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TESTING ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241105&DB=EPODOC&CC=US&NR=12137523B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241105&DB=EPODOC&CC=US&NR=12137523B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Korhonen, Pasi</creatorcontrib><creatorcontrib>Wuori, Topi</creatorcontrib><creatorcontrib>Apilo, Pälvi</creatorcontrib><creatorcontrib>Hänninen, Ilpo</creatorcontrib><creatorcontrib>Bräysy, Vinski</creatorcontrib><creatorcontrib>Keränen, Antti</creatorcontrib><creatorcontrib>Simula, Tomi</creatorcontrib><creatorcontrib>Heikkinen, Mikko</creatorcontrib><creatorcontrib>Sääski, Jarmo</creatorcontrib><title>Interface assembly and method for manufacturing interface assembly</title><description>An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDyzCtJLUpLTE5VSCwuTs1NyqlUSMxLUchNLcnIT1FIyy9SyE3MKwUqKCktysxLV8jEUM_DwJqWmFOcyguluRkU3VxDnD10Uwvy41OLC4Bq81JL4kODDY0Mjc1NjYydDI2JUQMAcPcynA</recordid><startdate>20241105</startdate><enddate>20241105</enddate><creator>Korhonen, Pasi</creator><creator>Wuori, Topi</creator><creator>Apilo, Pälvi</creator><creator>Hänninen, Ilpo</creator><creator>Bräysy, Vinski</creator><creator>Keränen, Antti</creator><creator>Simula, Tomi</creator><creator>Heikkinen, Mikko</creator><creator>Sääski, Jarmo</creator><scope>EVB</scope></search><sort><creationdate>20241105</creationdate><title>Interface assembly and method for manufacturing interface assembly</title><author>Korhonen, Pasi ; Wuori, Topi ; Apilo, Pälvi ; Hänninen, Ilpo ; Bräysy, Vinski ; Keränen, Antti ; Simula, Tomi ; Heikkinen, Mikko ; Sääski, Jarmo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12137523B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Korhonen, Pasi</creatorcontrib><creatorcontrib>Wuori, Topi</creatorcontrib><creatorcontrib>Apilo, Pälvi</creatorcontrib><creatorcontrib>Hänninen, Ilpo</creatorcontrib><creatorcontrib>Bräysy, Vinski</creatorcontrib><creatorcontrib>Keränen, Antti</creatorcontrib><creatorcontrib>Simula, Tomi</creatorcontrib><creatorcontrib>Heikkinen, Mikko</creatorcontrib><creatorcontrib>Sääski, Jarmo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Korhonen, Pasi</au><au>Wuori, Topi</au><au>Apilo, Pälvi</au><au>Hänninen, Ilpo</au><au>Bräysy, Vinski</au><au>Keränen, Antti</au><au>Simula, Tomi</au><au>Heikkinen, Mikko</au><au>Sääski, Jarmo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Interface assembly and method for manufacturing interface assembly</title><date>2024-11-05</date><risdate>2024</risdate><abstract>An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Interface assembly and method for manufacturing interface assembly |
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