Ultrasonic touch sensor
What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wher...
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| creator | Elian, Klaus Theuss, Horst |
| description | What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor. |
| format | Patent |
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COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; FOR PERFORMING MECHANICAL WORK IN GENERAL ; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL ; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY ; PERFORMING OPERATIONS ; PHYSICS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241105&DB=EPODOC&CC=US&NR=12135853B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241105&DB=EPODOC&CC=US&NR=12135853B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Elian, Klaus</creatorcontrib><creatorcontrib>Theuss, Horst</creatorcontrib><title>Ultrasonic touch sensor</title><description>What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>FOR PERFORMING MECHANICAL WORK IN GENERAL</subject><subject>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</subject><subject>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPzSkpSizOz8tMVijJL03OUChOzSvOL-JhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYZGhsamFqbGTkbGxKgBAOf9Iks</recordid><startdate>20241105</startdate><enddate>20241105</enddate><creator>Elian, Klaus</creator><creator>Theuss, Horst</creator><scope>EVB</scope></search><sort><creationdate>20241105</creationdate><title>Ultrasonic touch sensor</title><author>Elian, Klaus ; Theuss, Horst</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12135853B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>FOR PERFORMING MECHANICAL WORK IN GENERAL</topic><topic>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</topic><topic>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Elian, Klaus</creatorcontrib><creatorcontrib>Theuss, Horst</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Elian, Klaus</au><au>Theuss, Horst</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ultrasonic touch sensor</title><date>2024-11-05</date><risdate>2024</risdate><abstract>What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS PHYSICS TRANSPORTING |
| title | Ultrasonic touch sensor |
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