Technologies for plasma oxidation protection during hybrid bonding of semiconductor devices

Technologies for plasma oxidation protection during hybrid bonding of semiconductor devices includes forming a blocking layer on a metallic bonding pad formed in a bonding surface of a semiconductor device to be bonded and performing a surface treatment on the bonding surface to increase the bonding...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Rogers, Jack, Hoshino, Satohiko, Antonovich, Nathan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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