Atomic layer etching by electron wavefront

Atomic layer etching of a substrate using a wafer scale wave of precisely controlled electrons is presented. A volume of gaseous plasma including diluent and reactive species and electrons of a uniform steady state composition is generated in a positive column of a DC plasma proximate the substrate....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Anz, Samir John, Sando, Stewart Francis, Goddard, William Andrew, Margolese, David Irwin
Format: Patent
Sprache:eng
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