Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods
A method of operating a pattern recognition system of an electronic device packaging machine is provided. The method includes the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) utilizing a pattern recognition recipe in...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!