Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

A method of operating a pattern recognition system of an electronic device packaging machine is provided. The method includes the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) utilizing a pattern recognition recipe in...

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Bibliographische Detailangaben
1. Verfasser: Klaerner, Peter Julius
Format: Patent
Sprache:eng
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