Multi-layer printed circuit board made of different materials and manufacturing method thereof

A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive mat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Young Jun, Park, Eun Ha, Choi, Yu Jin, Kim, Chung Hyeon, Youn, Sang Wook, Park, Kum Sun
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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