Electronic package comprising wire inside an electronic component

An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the el...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lai, Chia-Chu, Chuang, Min-Han, Lin, Ho-Chuan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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