Composite insulating material based on dielectrophoretic force orientation and its preparation method
A composite insulating material based on dielectrophoretic force orientation and its preparation method are provided. The method includes: S1, preparing dielectric composite microspheres with a dielectric epoxy resin as a core and a hexagonal boron nitride sheet as a shell; S2, dispersing the hexago...
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creator | Wang, Zi Jia, Shenli Jiang, Guoqing Zhao, Lihua Bian, Chao Zeng, Ruichi Ren, Junwen Wei, Huachao |
description | A composite insulating material based on dielectrophoretic force orientation and its preparation method are provided. The method includes: S1, preparing dielectric composite microspheres with a dielectric epoxy resin as a core and a hexagonal boron nitride sheet as a shell; S2, dispersing the hexagonal boron nitride sheet and the dielectric composite microspheres in an organic solvent to obtain a dispersion liquid, and adding an epoxy resin, an epoxy resin curing agent, and an epoxy resin accelerator to the dispersing liquid, and evaporating the organic solvent to obtain a composite substrate; S3, pouring the composite substrate into a container, wherein an upper surface and a lower surface of the container are connected with electrodes, respectively, transferring the container to a vacuum oven, and connecting a power supply of the container to adjust a voltage amplitude and a frequency of the electrodes, conducting dielectrophoretic force orientation on the dielectric composite microspheres in the composite substrate, so as to cause the dielectric composite microspheres to arrange along a direction of electric field; S4, increasing a temperature of the container to cure the composite substrate, cutting off the power supply to the container after curing, and obtaining the composite insulating material. |
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The method includes: S1, preparing dielectric composite microspheres with a dielectric epoxy resin as a core and a hexagonal boron nitride sheet as a shell; S2, dispersing the hexagonal boron nitride sheet and the dielectric composite microspheres in an organic solvent to obtain a dispersion liquid, and adding an epoxy resin, an epoxy resin curing agent, and an epoxy resin accelerator to the dispersing liquid, and evaporating the organic solvent to obtain a composite substrate; S3, pouring the composite substrate into a container, wherein an upper surface and a lower surface of the container are connected with electrodes, respectively, transferring the container to a vacuum oven, and connecting a power supply of the container to adjust a voltage amplitude and a frequency of the electrodes, conducting dielectrophoretic force orientation on the dielectric composite microspheres in the composite substrate, so as to cause the dielectric composite microspheres to arrange along a direction of electric field; S4, increasing a temperature of the container to cure the composite substrate, cutting off the power supply to the container after curing, and obtaining the composite insulating material.</description><language>eng</language><subject>ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; PREPARATION OF CARBON BLACK ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240924&DB=EPODOC&CC=US&NR=12098263B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240924&DB=EPODOC&CC=US&NR=12098263B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wang, Zi</creatorcontrib><creatorcontrib>Jia, Shenli</creatorcontrib><creatorcontrib>Jiang, Guoqing</creatorcontrib><creatorcontrib>Zhao, Lihua</creatorcontrib><creatorcontrib>Bian, Chao</creatorcontrib><creatorcontrib>Zeng, Ruichi</creatorcontrib><creatorcontrib>Ren, Junwen</creatorcontrib><creatorcontrib>Wei, Huachao</creatorcontrib><title>Composite insulating material based on dielectrophoretic force orientation and its preparation method</title><description>A composite insulating material based on dielectrophoretic force orientation and its preparation method are provided. 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subjects | ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PREPARATION OF CARBON BLACK THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | Composite insulating material based on dielectrophoretic force orientation and its preparation method |
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