Air spacer formation with a spin-on dielectric material

The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Chen, Ting-Ting, Ho, Tsai-Jung, Liang, Shuen-Shin, Lin, Keng-Chu, Cheng, Yahru, Ko, Tsung-Han, Perng, Tsu-Hsiu, Ueno, Tetsuji, Wang, Chen-Han
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Chen, Ting-Ting
Ho, Tsai-Jung
Liang, Shuen-Shin
Lin, Keng-Chu
Cheng, Yahru
Ko, Tsung-Han
Perng, Tsu-Hsiu
Ueno, Tetsuji
Wang, Chen-Han
description The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12094952B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12094952B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12094952B23</originalsourceid><addsrcrecordid>eNrjZDB3zCxSKC5ITE4tUkjLL8pNLMnMz1MozyzJUEgEimfm6QK5KZmpOanJJUWZyQpABalFmYk5PAysaYk5xam8UJqbQdHNNcTZQze1ID8-FWxgXmpJfGiwoZGBpYmlqZGTkTExagC41y3j</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Air spacer formation with a spin-on dielectric material</title><source>esp@cenet</source><creator>Chen, Ting-Ting ; Ho, Tsai-Jung ; Liang, Shuen-Shin ; Lin, Keng-Chu ; Cheng, Yahru ; Ko, Tsung-Han ; Perng, Tsu-Hsiu ; Ueno, Tetsuji ; Wang, Chen-Han</creator><creatorcontrib>Chen, Ting-Ting ; Ho, Tsai-Jung ; Liang, Shuen-Shin ; Lin, Keng-Chu ; Cheng, Yahru ; Ko, Tsung-Han ; Perng, Tsu-Hsiu ; Ueno, Tetsuji ; Wang, Chen-Han</creatorcontrib><description>The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240917&amp;DB=EPODOC&amp;CC=US&amp;NR=12094952B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240917&amp;DB=EPODOC&amp;CC=US&amp;NR=12094952B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chen, Ting-Ting</creatorcontrib><creatorcontrib>Ho, Tsai-Jung</creatorcontrib><creatorcontrib>Liang, Shuen-Shin</creatorcontrib><creatorcontrib>Lin, Keng-Chu</creatorcontrib><creatorcontrib>Cheng, Yahru</creatorcontrib><creatorcontrib>Ko, Tsung-Han</creatorcontrib><creatorcontrib>Perng, Tsu-Hsiu</creatorcontrib><creatorcontrib>Ueno, Tetsuji</creatorcontrib><creatorcontrib>Wang, Chen-Han</creatorcontrib><title>Air spacer formation with a spin-on dielectric material</title><description>The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB3zCxSKC5ITE4tUkjLL8pNLMnMz1MozyzJUEgEimfm6QK5KZmpOanJJUWZyQpABalFmYk5PAysaYk5xam8UJqbQdHNNcTZQze1ID8-FWxgXmpJfGiwoZGBpYmlqZGTkTExagC41y3j</recordid><startdate>20240917</startdate><enddate>20240917</enddate><creator>Chen, Ting-Ting</creator><creator>Ho, Tsai-Jung</creator><creator>Liang, Shuen-Shin</creator><creator>Lin, Keng-Chu</creator><creator>Cheng, Yahru</creator><creator>Ko, Tsung-Han</creator><creator>Perng, Tsu-Hsiu</creator><creator>Ueno, Tetsuji</creator><creator>Wang, Chen-Han</creator><scope>EVB</scope></search><sort><creationdate>20240917</creationdate><title>Air spacer formation with a spin-on dielectric material</title><author>Chen, Ting-Ting ; Ho, Tsai-Jung ; Liang, Shuen-Shin ; Lin, Keng-Chu ; Cheng, Yahru ; Ko, Tsung-Han ; Perng, Tsu-Hsiu ; Ueno, Tetsuji ; Wang, Chen-Han</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12094952B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Chen, Ting-Ting</creatorcontrib><creatorcontrib>Ho, Tsai-Jung</creatorcontrib><creatorcontrib>Liang, Shuen-Shin</creatorcontrib><creatorcontrib>Lin, Keng-Chu</creatorcontrib><creatorcontrib>Cheng, Yahru</creatorcontrib><creatorcontrib>Ko, Tsung-Han</creatorcontrib><creatorcontrib>Perng, Tsu-Hsiu</creatorcontrib><creatorcontrib>Ueno, Tetsuji</creatorcontrib><creatorcontrib>Wang, Chen-Han</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, Ting-Ting</au><au>Ho, Tsai-Jung</au><au>Liang, Shuen-Shin</au><au>Lin, Keng-Chu</au><au>Cheng, Yahru</au><au>Ko, Tsung-Han</au><au>Perng, Tsu-Hsiu</au><au>Ueno, Tetsuji</au><au>Wang, Chen-Han</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Air spacer formation with a spin-on dielectric material</title><date>2024-09-17</date><risdate>2024</risdate><abstract>The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US12094952B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Air spacer formation with a spin-on dielectric material
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T17%3A18%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chen,%20Ting-Ting&rft.date=2024-09-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12094952B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true