Wafer edge ring lifting solution

Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward e...

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Bibliographische Detailangaben
Hauptverfasser: Luere, Olivier, Rice, Michael R, Koosau, Denis M, Yousif, Imad, Sarode Vishwanath, Yogananda, Srinivasan, Sunil, Dhindsa, Rajinder, Babayan, Steven E
Format: Patent
Sprache:eng
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