Packaged integrated circuit devices with through-body conductive vias, and methods of making same

A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

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Hauptverfasser:	Chia, Yong Poo, Jiang, Tongbi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	Chia, Yong Poo Jiang, Tongbi
description	A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12087738B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12087738B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12087738B23</originalsourceid><addsrcrecordid>eNqNyrEOgjAQgGEWB6O-w7lLojDArNE4mqgzOa9He0Fa0h4Y314HH8Dp_4Z_nuEFqUPLBsQr24j6JUmkURQMT0Kc4CXqQF0Mo3X5I5g3UPBmJJWJYRJMG0BvoGd1wSQILfTYibeQsOdlNmvxmXj16yJbn463wznnITScBiT2rM39uiu2dVWV9b4o_3k-GI891Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaged integrated circuit devices with through-body conductive vias, and methods of making same</title><source>esp@cenet</source><creator>Chia, Yong Poo ; Jiang, Tongbi</creator><creatorcontrib>Chia, Yong Poo ; Jiang, Tongbi</creatorcontrib><description>A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240910&DB=EPODOC&CC=US&NR=12087738B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240910&DB=EPODOC&CC=US&NR=12087738B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chia, Yong Poo</creatorcontrib><creatorcontrib>Jiang, Tongbi</creatorcontrib><title>Packaged integrated circuit devices with through-body conductive vias, and methods of making same</title><description>A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEOgjAQgGEWB6O-w7lLojDArNE4mqgzOa9He0Fa0h4Y314HH8Dp_4Z_nuEFqUPLBsQr24j6JUmkURQMT0Kc4CXqQF0Mo3X5I5g3UPBmJJWJYRJMG0BvoGd1wSQILfTYibeQsOdlNmvxmXj16yJbn463wznnITScBiT2rM39uiu2dVWV9b4o_3k-GI891Q</recordid><startdate>20240910</startdate><enddate>20240910</enddate><creator>Chia, Yong Poo</creator><creator>Jiang, Tongbi</creator><scope>EVB</scope></search><sort><creationdate>20240910</creationdate><title>Packaged integrated circuit devices with through-body conductive vias, and methods of making same</title><author>Chia, Yong Poo ; Jiang, Tongbi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12087738B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Chia, Yong Poo</creatorcontrib><creatorcontrib>Jiang, Tongbi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chia, Yong Poo</au><au>Jiang, Tongbi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaged integrated circuit devices with through-body conductive vias, and methods of making same</title><date>2024-09-10</date><risdate>2024</risdate><abstract>A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US12087738B2
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Packaged integrated circuit devices with through-body conductive vias, and methods of making same
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T01%3A27%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chia,%20Yong%20Poo&rft.date=2024-09-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12087738B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true