Chip protected against back-face attacks

A method for fabricating a semiconductor chip includes forming a plurality of conducting pads at a front face of a substrate, thinning a rear face of the substrate, etching openings under each conducting pad from the rear face, depositing a layer of a dielectric on walls and a bottom of the openings...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bianchi, Raul Andres, Petitdidier, Sebastien, Farcy, Alexis, Froment, Benoit, Hotellier, Nicolas
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PULSE TECHNIQUE SEMICONDUCTOR DEVICES
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