Semiconductor devices with recessed pads for die stack interconnections

Semiconductor devices having electrical interconnections through vertically stacked semiconductor dies, and associated systems and methods, are disclosed herein. In some embodiments, a semiconductor assembly includes a die stack having a plurality of semiconductor dies. Each semiconductor die can in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sheng, Ruei Ying, Bayless, Andrew M, Wirz, Brandon P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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