Electronic power package and heat sink/cold rail arrangement
An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
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| creator | Wong, Wai Kwan Pan, Binghua Ihms, David W |
| description | An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Electronic power package and heat sink/cold rail arrangement |
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