Support plate for localized heating in thermal processing systems

Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Keppler, Johannes, Hülsmann, Thorsten, Yang, Michael X, Bremensdorfer, Rolf
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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