Support plate for localized heating in thermal processing systems
Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that...
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| creator | Keppler, Johannes Hülsmann, Thorsten Yang, Michael X Bremensdorfer, Rolf |
| description | Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12080568B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12080568B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12080568B23</originalsourceid><addsrcrecordid>eNrjZHAMLi0oyC8qUSjISSxJVUjLL1LIyU9OzMmsSk1RyEhNLMnMS1fIzFMoyUgtyk3MUSgoyk9OLS4GiRZXFpek5hbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDIwMLA1MzCycjY2LUAABDRjJi</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Support plate for localized heating in thermal processing systems</title><source>esp@cenet</source><creator>Keppler, Johannes ; Hülsmann, Thorsten ; Yang, Michael X ; Bremensdorfer, Rolf</creator><creatorcontrib>Keppler, Johannes ; Hülsmann, Thorsten ; Yang, Michael X ; Bremensdorfer, Rolf</creatorcontrib><description>Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240903&DB=EPODOC&CC=US&NR=12080568B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240903&DB=EPODOC&CC=US&NR=12080568B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Keppler, Johannes</creatorcontrib><creatorcontrib>Hülsmann, Thorsten</creatorcontrib><creatorcontrib>Yang, Michael X</creatorcontrib><creatorcontrib>Bremensdorfer, Rolf</creatorcontrib><title>Support plate for localized heating in thermal processing systems</title><description>Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMLi0oyC8qUSjISSxJVUjLL1LIyU9OzMmsSk1RyEhNLMnMS1fIzFMoyUgtyk3MUSgoyk9OLS4GiRZXFpek5hbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDIwMLA1MzCycjY2LUAABDRjJi</recordid><startdate>20240903</startdate><enddate>20240903</enddate><creator>Keppler, Johannes</creator><creator>Hülsmann, Thorsten</creator><creator>Yang, Michael X</creator><creator>Bremensdorfer, Rolf</creator><scope>EVB</scope></search><sort><creationdate>20240903</creationdate><title>Support plate for localized heating in thermal processing systems</title><author>Keppler, Johannes ; Hülsmann, Thorsten ; Yang, Michael X ; Bremensdorfer, Rolf</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12080568B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Keppler, Johannes</creatorcontrib><creatorcontrib>Hülsmann, Thorsten</creatorcontrib><creatorcontrib>Yang, Michael X</creatorcontrib><creatorcontrib>Bremensdorfer, Rolf</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Keppler, Johannes</au><au>Hülsmann, Thorsten</au><au>Yang, Michael X</au><au>Bremensdorfer, Rolf</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Support plate for localized heating in thermal processing systems</title><date>2024-09-03</date><risdate>2024</risdate><abstract>Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Support plate for localized heating in thermal processing systems |
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